Electrical Features

•Blocking voltage 1200V

•Low VCEsat

•Low Switching Losses

•Low Qg and Crss

•Low Inductive Design

•Tvj op = 150°C

Mechanical Features

•4.2kV DC 1sec Insulation

•High Creepage and Clearance Distances

•High Power Density

•High Performance Si3N4 Ceramic

•Direct Cooled PinFin Base Plate

•Guiding elements for PCB and cooler assembly

•Integrated NTC temperature sensor

•PressFIT Contact Technology

•RoHS compliant

•UL 94 V0 module frame

Description

The HybridPACKTM Drive is a very compact

six-pack module (1200V/380A) optimized for hybrid

and electric vehicles. The power module

implements the IGBT4 generation. The chipset has

high short circuit ruggedness and come with a

matching efficient and soft switching Emcon4 diode.

The new HybridPACKTM Drive power module family

comes with mechanical guiding elements

supporting easy assembly processes for customers.

Furthermore, the press-fit pins for the signal

terminals avoid additional time consuming selective

solder processes, which provides cost savings on

system level and increases system reliability. The

direct cooled baseplate with PinFin structure and

optimized ceramic material in the

FS380R12A6T4LB product best utilizes the

implemented chipset and shows superior thermal

characteristics. Due to the high clearance &

creepage distances, the module well suited for

increased system working voltages and supports

modular inverter approaches.