Features

• SEMPER™ Flash and HYPERRAM™2.0 with HYPERBUS™ interface in multi-chip package (MCP)

- 1.8 V, 512Mb SEMPER™ Flash and 64Mb HYPERRAM™ 2.0 (S76HS512TC0)

- 3.0 V, 512Mb SEMPER™ Flash and 64Mb HYPERRAM™ 2.0 (S76HL512TC0)

- FBGA 24-ball, 8 × 8 × 1.2 mm packages

• HYPERBUS™ interface

- 1.8 V I/O (S76HS-TC0)

- 3.0 V I/O (S76HL-TC0)

- Chip select (CS#)

- 8-bit data bus (DQ[7:0])

- Data strobe (DS/RWDS)

• Bidirectional DS/mask

• Output at the start of all transactions to indicate refresh latency

• Output during read transactions as read DS

• Input during write transactions as write data mask (HYPERRAM™ only)

• Optional signals

- INT# output to generate external interrupt

• Busy to ready transition

- RSTO# output to generate system level power-on-reset (POR)

• User configurable RSTO# LOW period

• High-performance

- DDR

• Two data transfers per clock

- Up to 200 MHz clock rate (400-MBps) at 1.8 V VCC

- Up to 166 MHz clock rate (333-MBps) at 3.0 V VCC