Features

 Serial Peripheral Interface (SPI) with Multi-I/O

– Clock polarity and phase modes 0 and 3

– Double Data Rate (DDR) option

– Quad peripheral interface (QPI) option

– Extended addressing: 24- or 32-bit address options

– Serial command subset and footprint compatible with S25FL-A,

S25FL1-K, S25FL-P, S25FL-S, and S25FS-S SPI families

– Multi I/O command subset and footprint compatible with S25FL-P,

S25FL-S and S25FS-S SPI families

 Read

– Commands: Normal, Fast, Dual I/O, Quad I/O, DualO, QuadO,

DDR Quad I/O

– Modes: Burst wrap, Continuous (XIP), QPI

– Serial flash discoverable parameters (SFDP) for configuration

information

 Program Architecture

– 256-Bytes page programming buffer

– Program suspend and resume

 Erase Architecture

– Uniform 4 KB sector erase

– Uniform 32 KB half block erase

– Uniform 64 KB block erase

– Chip erase

– Erase suspend and resume

 100,000 Program-Erase Cycles, minimum

 20 Year Data Retention, minimum

 Security Features

– Status and configuration Register protection

– Four security regions of 256-bytes each outside the main Flash

array

– Legacy block protection: Block range

– Individual and region protection

– Individual block lock: Volatile individual sector/block

– Pointer region: Non-volatile sector/block range

– Power supply Lock-down, password, or permanent protection

of security regions 2 and 3 and pointer region

 Technology

– 65-nm Floating Gate technology

 Single Supply Voltage with CMOS I/O

– 2.7 V to 3.6 V

 Temperature Range / Grade

– Industrial (–40°C to +85°C)

– Industrial Plus (–40°C to +105°C)

– Automotive, AEC-Q100 Grade 3 (–40°C to +85°C)

– Automotive, AEC-Q100 Grade 2 (–40°C to +105°C)

– Automotive, AEC-Q100 Grade 1 (–40°C to +125°C)

 Packages (All Pb-free)

– 8-lead SOIC 208 mil (SOC008)

– 16-lead SOIC 300 mil (SO3016)

– USON 4  4 mm (UNF008)

– WSON 5 x 6 mm (WND008)

– BGA-24 6  8 mm

– 5  5 ball (FAB024) footprint

– 4  6 ball (FAC024) footprint

– Known good die and known tested die