Features

Package

 Fully isolated dual in-line molded module

 Very low thermal resistance due to DCB substrate

 Lead-free terminal plating; RoHS compliant

Inverter

 TRENCHSTOP™ IGBTs for inverter

 Rugged SOI gate driver technology with stability

against transient and negative voltage

 Allowable negative VS potential up to -11 V

for signal transmission at VBS = 15 V

 Integrated bootstrap functionality

 Over-current shutdown

 Built-in NTC thermistor for temperature monitor

 Under-voltage lockout at all channels

 Low-side common emitter

 Cross-conduction prevention

 All of 6 switches turn off during protection

PFC

 TRENCHSTOP™ IGBT for PFC

 Rapid switching emitter controlled diode