Module description

• Module size: 13.31 × 21.89 × 1.95 mm

• Bluetooth® 5.0 qualified smart ready module

- QDID: TBD

- Declaration ID: TBD

• Certified to FCC, ISED, MIC, and CE regulations

• Castelated solder pad connections for ease-of-use

• 512-KB on-module serial flash memory

• Up to 24 GPIOs

• Temperature range: –30 °C to +85 °C

• Cortex-M4 32-bit processor

• Maximum TX output power

- +12 dBm for Bluetooth® Low Energy

• Bluetooth® LE connection range of up to 250 meters at 12 dBm[1]

• RX receive sensitivity:

- Bluetooth® Low Energy: –94.5 dBm