型号 功能描述 生产厂家 企业 LOGO 操作
IRKT91-04AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

更新时间:2025-9-28 14:16:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
23+
模块
120
全新原装正品,量大可订货!可开17%增值票!价格优势!
IOR
23+
MOKUAI
8650
受权代理!全新原装现货特价热卖!
IR
23+
MODULE
24602
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
23+
模块
3562
IR
25+
2THY91A1
3000
全新原装、诚信经营、公司现货销售
IR
22+
MODULE
6000
终端可免费供样,支持BOM配单
IR
23+
TO-59
8510
原装正品代理渠道价格优势
IR
24+
模块
6430
原装现货/欢迎来电咨询

IRKT91-04AS90芯片相关品牌

IRKT91-04AS90数据表相关新闻