POWER MODULE

文件：1.89995 Mbytes Page：5 Pages

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes Page：8 Pages

封装/外壳：ADD-A-PAK（3 + 4） 包装：散装 描述：SCR DBL HISCR 1600V 27A ADDAPAK 分立半导体产品 晶闸管 - SCR - 模块

SCR DBL HISCR 1600V 27A ADDAPAK

ADD-A-pak-TM GEN V Power Modules

文件：155.55 Kbytes Page：8 Pages

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件：157.8 Kbytes Page：8 Pages

POWER MOD ULE

文件：2.45516 Mbytes Page：4 Pages

POWER MODULE

文件：1.89995 Mbytes Page：5 Pages