型号 功能描述 生产厂家 企业 LOGO 操作
IRKT26/12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

IRF

IRKT26/12AS90

ADD-A-pakTM GEN V Power Modules

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. Features ■ Hig

IRF

IRKT26/12AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件:157.8 Kbytes Page:8 Pages

IRF

IRKT26/12AS90

ADD-A-pak-TM GEN V Power Modules

文件:155.55 Kbytes Page:8 Pages

IRF

更新时间:2025-11-29 16:31:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
23+
模块
240
全新原装正品,量大可订货!可开17%增值票!价格优势!
IR
23+
module
8000
只做原装现货
IR
23+
module
7000
IR
23+
MODULE
16453
##公司主营品牌长期供应100%原装现货可含税提供技术
IR
1923+
NA
3689
原装进口现货库存专业工厂研究所配单供货
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
25+
MODULE
100
就找我吧!--邀您体验愉快问购元件!
IR
22+
module
6000
终端可免费供样,支持BOM配单
IR
24+
模块
6430
原装现货/欢迎来电咨询
IR
24+
MODULE
60000

IRKT26/12AS90数据表相关新闻