型号 功能描述 生产厂家&企业 LOGO 操作
IRKH91/10AS90

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

Mechanical Description The Generation V of Add-A-pak module combine the excellent thermal performance obtained by the usage of Direct Bonded Copper substrate with superior mechanical ruggedness, thanks to the insertion of a solid Copper baseplate at the bottom side of the device. The Cu basepla

IRF

THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件:240.36 Kbytes Page:10 Pages

IRF

ADD-A-pak GEN V Power Modules THYRISTOR/ DIODE and THYRISTOR/ THYRISTOR

文件:237.43 Kbytes Page:10 Pages

IRF

更新时间:2025-8-10 22:30:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IR
24+
module
6000
全新原装正品现货 假一赔佰
IR
1950+
980
只做原装正品现货!或订货假一赔十!
IR
25+
原厂原封可拆样
64586
百分百原装现货 实单必成
IR
23+
模块
3562
IR
12
公司优势库存 热卖中!!
IR
23+
7000
IR
23+
MODULE
7300
专注配单,只做原装进口现货
IR
专业模块
MODULE
8513
模块原装主营-可开原型号增税票
IR
22+
6000
终端可免费供样,支持BOM配单
IR
23+
标准封装
5000
原厂授权一级代理 IGBT模块 可控硅 晶闸管 熔断器质保

IRKH91/10AS90数据表相关新闻