HEXFET Power MOSFET

Features and Benefits Features Low RDSon (≤ 2.6mΩ) Low Thermal Resistance to PCB (≤ 0.8°C/W) 100 Rg tested Low Profile (≤ 0.9 mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halo

Secondary Side Synchronous Rectification

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Dual-Channel Low Noise Amplifier 10.7 – 12.75 GHz

Features ■ Frequency: 10.7 – 12.75 GHz ■ Gain: 19.5dB ■ Noise Figure: 1.4dB ■ Output P1dB: -7dBm ■ Power Consumption: 12.5mW/ch ■ Channel Isolation: 37dB minimum ■ Supply Voltage: 0.9 – 1.0V ■ Common bias control input ■ Compact size for planar integration on λ/2 grid ■ 2.7 × 2.7 × 0.9 m

THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

TYPE N MALE TO SMA FEMALE ADAPTER

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

3M??Paint Replacement Tape (appliqu챕) 5004

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