HEXFET Power MOSFET

Features and Benefits Features Low RDSon (≤ 2.6mΩ) Low Thermal Resistance to PCB (≤ 0.8°C/W) 100 Rg tested Low Profile (≤ 0.9 mm) Industry-Standard Pinout Compatible with Existing Surface Mount Techniques RoHS Compliant Containing no Lead, no Bromide and no Halo

Secondary Side Synchronous Rectification

文件：265.33 Kbytes Page：9 Pages

Secondary Side Synchronous Rectification

文件：1.14036 Mbytes Page：10 Pages

Secondary Side Synchronous Rectification

文件：265.33 Kbytes Page：9 Pages

TYPE N MALE TO SMA FEMALE ADAPTER

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

Dual-Channel Low Noise Amplifier 10.7 – 12.75 GHz

Features ■ Frequency: 10.7 – 12.75 GHz ■ Gain: 19.5dB ■ Noise Figure: 1.4dB ■ Output P1dB: -7dBm ■ Power Consumption: 12.5mW/ch ■ Channel Isolation: 37dB minimum ■ Supply Voltage: 0.9 – 1.0V ■ Common bias control input ■ Compact size for planar integration on λ/2 grid ■ 2.7 × 2.7 × 0.9 m

THRU HOLE MOUNT TEST POINTS - COLOR KEYED

• Color keyed for visibility and quick identification • Economical choice for PC test point terminations • Snap-fit mounting provides positive retention for wave soldering • Wire form loop for safe, non-slip testing • Space saving, ultra low and low profile designs • High profile design for d

THM TEST POINTS

(THM)THRU HOLE MOUNT TEST POINTS-COLOR KEYED •Color keyed for visibility and quick identification •Economical choice for PC test point terminations •Snap-fit mounting provides positive retention for wave soldering •Wire form loop for safe, non-sliptesting •Space saving, ultra low

3M??Paint Replacement Tape (appliqu챕) 5004

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