型号 功能描述 生产厂家&企业 LOGO 操作
IDT71V35761SA183BQ

128Kx36,256Kx183.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Description TheIDT71V35761/781arehigh-speedSRAMsorganizedas128Kx36/256Kx18.TheIDT71V35761/781SRAMscontainwrite,data,addressandcontrolregisters.InternallogicallowstheSRAMtogenerateaself-timedwritebaseduponadecisionwhichcanbeleftuntiltheendofthewritec

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT
IDT71V35761SA183BQ

封装/外壳:165-TBGA 包装:托盘 描述:IC SRAM 4.5MBIT PAR 165CABGA 集成电路(IC) 存储器

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx36,256Kx183.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Description TheIDT71V35761/781arehigh-speedSRAMsorganizedas128Kx36/256Kx18.TheIDT71V35761/781SRAMscontainwrite,data,addressandcontrolregisters.InternallogicallowstheSRAMtogenerateaself-timedwritebaseduponadecisionwhichcanbeleftuntiltheendofthewritec

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT

3.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

文件:972.44 Kbytes Page:21 Pages

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT

3.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

文件:972.44 Kbytes Page:21 Pages

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT

3.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

文件:972.44 Kbytes Page:21 Pages

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT

3.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

文件:972.44 Kbytes Page:21 Pages

IDTIntegrated Device Technology, Inc.

集成器深圳市集成器件技术有限公司

IDT

封装/外壳:165-TBGA 包装:托盘 描述:IC SRAM 4.5MBIT PAR 165CABGA 集成电路(IC) 存储器

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx363.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Features ◆128Kx36memoryconfigurations ◆Supportshighsystemspeed: Commercial: –200MHz3.1nsclockaccesstime CommercialandIndustrial: –183MHz3.3nsclockaccesstime –166MHz3.5nsclockaccesstime ◆LBOinputselectsinterleavedorlinearburstmode ◆3.3Vcorepowersupply

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx363.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Features ◆128Kx36memoryconfigurations ◆Supportshighsystemspeed: Commercial: –200MHz3.1nsclockaccesstime CommercialandIndustrial: –183MHz3.3nsclockaccesstime –166MHz3.5nsclockaccesstime ◆LBOinputselectsinterleavedorlinearburstmode ◆3.3Vcorepowersupply

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx363.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Features ◆128Kx36memoryconfigurations ◆Supportshighsystemspeed: Commercial: –200MHz3.1nsclockaccesstime CommercialandIndustrial: –183MHz3.3nsclockaccesstime –166MHz3.5nsclockaccesstime ◆LBOinputselectsinterleavedorlinearburstmode ◆3.3Vcorepowersupply

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx363.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Features ◆128Kx36memoryconfigurations ◆Supportshighsystemspeed: Commercial: –200MHz3.1nsclockaccesstime CommercialandIndustrial: –183MHz3.3nsclockaccesstime –166MHz3.5nsclockaccesstime ◆LBOinputselectsinterleavedorlinearburstmode ◆3.3Vcorepowersupply

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

128Kx363.3VSynchronousSRAMs3.3VI/O,PipelinedOutputsBurstCounter,SingleCycleDeselect

Features ◆128Kx36memoryconfigurations ◆Supportshighsystemspeed: Commercial: –200MHz3.1nsclockaccesstime CommercialandIndustrial: –183MHz3.3nsclockaccesstime –166MHz3.5nsclockaccesstime ◆LBOinputselectsinterleavedorlinearburstmode ◆3.3Vcorepowersupply

RENESASRenesas Electronics America

瑞萨瑞萨科技有限公司

RENESAS

IDT71V35761SA183BQ产品属性

  • 类型

    描述

  • 型号

    IDT71V35761SA183BQ

  • 功能描述

    IC SRAM 4MBIT 183MHZ 165FBGA

  • RoHS

  • 类别

    集成电路(IC) >> 存储器

  • 系列

    -

  • 标准包装

    576

  • 系列

    - 格式 -

  • 存储器

    闪存

  • 存储器类型

    闪存 - NAND

  • 存储容量

    512M(64M x 8)

  • 速度

    -

  • 接口

    并联

  • 电源电压

    2.7 V ~ 3.6 V

  • 工作温度

    -40°C ~ 85°C

  • 封装/外壳

    48-TFSOP(0.724,18.40mm 宽)

  • 供应商设备封装

    48-TSOP

  • 包装

    托盘

  • 其它名称

    497-5040

更新时间:2024-5-15 17:51:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
IDT
21+
165CABGA (13x15)
13880
公司只售原装,支持实单
IDT, Integrated Device Technol
21+
165-CABGA(13x15)
56200
一级代理/放心采购
IDT
23+
165-CABGA(13x15)
7050
专业分销产品!原装正品!价格优势!
IDT
14+
FBGA165
1500
只有原装!只做原装!一片起卖!
IDT
22+
165CABGA (13x15)
9000
原厂渠道,现货配单
IDT
23+
165CABGA (13x15)
9000
原装正品,支持实单
IDT
23+
165-FBGA
3154
原装现货
IDT, Integrated Device Techno
23+
165-CABGA13x15
7300
专注配单,只做原装进口现货
Renesas Electronics America In
24+
165-TBGA
9350
独立分销商,公司只做原装,诚心经营,免费试样正品保证
IDT, Integrated Device Techno
23+
165-CABGA13x15
7300
专注配单,只做原装进口现货

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