Description

These solid state surface mount indicators are designed with a flat top and sides to be easily handled by automatic placement equipment. A glue pad is provided for adhesive mounting processes. They are compatible with convective IR and vapor phase reflow soldering and conductive epoxy attachment processes.

Features

• Compatible with Automatic Placement Equipment

• Compatible with Infrared and Vapor Phase Reflow Solder Processes

• Packaged in 12 mm or 8 mm tape on 7 or 13 Diameter Reels

• EIA Standard Package

• Low Package Profile

• Nondiffused Package Excellent for Backlighting and Coupling to Light Pipes