位置:HB28E016BP2 > HB28E016BP2详情

HB28E016BP2中文资料

厂家型号

HB28E016BP2

文件大小

328.07Kbytes

页面数量

90

功能描述

Mobile Embedded Flash with MultiMediaCard-TM Interface 16 Mbyte/32 Mbyte

数据手册

下载地址一下载地址二到原厂下载

简称

HITACHI日立

生产厂商

Hitachi Semiconductor

中文名称

日立公司官网

HB28E016BP2数据手册规格书PDF详情

Description

The HB28E016BP2 and HB28D032BP2 are Hitachi Mobile Embedded Flashes with MultiMediaCardTM interface, which are highly integrated flash memories with serial and random access capability. It is accessible via a dedicated serial interface optimized for fast and reliable data transmission. This interface allows several cards to be stacked by through connecting their peripheral contacts. These Hitachi Mobile Embedded Flashes are fully compatible to a new consumer standard, called the MultiMediaCard system standard defined in the MultiMediaCard system specification [1], except the physical outline and the pin assignment.

Features

• 16 MByte/32 MByte memory capacity

• On card error correction

• MultiMediaCard system standard compatibility

- System specification version 3.1 compliant

- SPI mode supports the single and multiple block read and write operations.

- Block and partial block read supported (Command classes 2)

- Stream read supported (Command class 1)

- Block write and erase supported (Command classes 4 and 5)

- Group write protection (Command classes 6)

- Stream write supported (Command classes 3)

- Password data access protection

- Small erase block size of 512 bytes, tagged erase supported

- Read block size programmable between 1 and 2048 bytes

- VCC = 2.7 V to 3.6 V operation voltage range (VCC = 2.0 V to 3.6 V for the interface)

- No external programming voltage required

- 4kV ESD protection (Contact Pads)

• High speed serial interface with random access

- Read speed: sustained: 13.7 Mbit/s (multi-block read) burst (one block): 20 Mbit/s

- Write speed: sustained: 6.4 Mbit/s (multi-block write) burst (one block): 20 Mbit/s

- Up to 10 stacked card (at 20 MHz, VCC = 2.7 to 3.6V)

- Access time: 300 µs (typ) (at 20 MHz, VCC = 2.7 to 3.6V)

• Low power dissipation

- High speed: 216 mW (max) (at 20 MHz, VCC = 3.6 V)

• Compact package for mobile phone and etc.

- 9 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71AV)

- 10 mm × 11 mm × 1.4 mm (max) 71-bump 0.8 mm ball pitch FBGA (BP-71V)

更新时间:2025-10-13 15:16:00
供应商 型号 品牌 批号 封装 库存 备注 价格
RENESAS
23+
65480
HBO
24+
DIP-32
240
HBO
01+
DIP-32
4202
原装现货海量库存欢迎咨询
HBO
DIP-32
68500
一级代理 原装正品假一罚十价格优势长期供货
HBO
2402+
DIP-32
8324
原装正品!实单价优!
RICHWELL
2447
NA
100500
一级代理专营品牌!原装正品,优势现货,长期排单到货
HINT
2022+
9
全新原装 货期两周
PANASONIC/松下
23+
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
松下
20+
DIP
15800
原装优势主营型号-可开原型号增税票
PANASONIC/松下
23+
DIP
50000
全新原装正品现货,支持订货