型号 功能描述 生产厂家&企业 LOGO 操作
HBN410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBN410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBN410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBN410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

HBN410

Glass Passivated Single-Phase 4.0Amp Surface Mount Bridge Rectifier

Features  Surface mount bridge, small package;  Ideal for printed circuit boards;  Glass passivated chip junction;  High surge current capability;  High heat dissipation capability;  Low profile package;  Low forward voltage drop;  Plastic package has Underwrites LaboratoryF

SMCDIODE

桑德斯微电子

Integrated Soldier Power and Data Management System (ISPDS) with USB.3.0 and 1G LAN Capabilities

FEATURES DESCRIPTION The advancement of technologies in the modern warfare has allowed the design of increasingly versatile tools in order to perform effectively and coherently in the battlefield. The modern infantry soldier, fully equipped with advanced weapon and communication systems, has

ENERCON

Celeron M Processor on 65 nm Process

文件:1.93023 Mbytes Page:71 Pages

Intel

英特尔

Detectable Buried Barricade Tapes 400 Series

文件:53.73 Kbytes Page:2 Pages

3M

Replace “XX” with 01 through 12 for number of poles 11/16 (.688) pitch

文件:597.06 Kbytes Page:3 Pages

MARATHON

Heavy-Duty Hydra-Lift Karriers

文件:1.04551 Mbytes Page:3 Pages

MORSE

Morse Mfg. Co., Inc.

更新时间:2025-8-17 23:01:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
CYSTEK
24+
NA/
12286
优势代理渠道,原装正品,可全系列订货开增值税票
CYSTEK
24+
SOT-363-6
880000
明嘉莱只做原装正品现货
CYSTEK
24+
SOT-163SOT-23-6
15200
新进库存/原装
CYSTEK
13+
SOT-363-6
60000
一级代理,专注军工、汽车、医疗、工业、新能源、电力
CYSTECH/全宇昕
20+
SOP-8
120000
只做原装 可免费提供样品
CYSTEK
23+
SOT-363-6
50000
全新原装正品现货,支持订货
CYSTECH/全宇昕
2511
SOP-8
360000
电子元器件采购降本 30%!盈慧通原厂直采,砍掉中间差价
CYSTEK
23+
SOT-363
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
CYSTEK
23+
SOT163
50000
全新原装正品现货,支持订货
SOT-163
23+
NA
15659
振宏微专业只做正品,假一罚百!

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