FEATURES

♦ For surface mounted applications in order to optimize board space

♦ Low profile package

♦ Built-in strain relief

♦ Glass passivated junction

♦ Low inductance

♦ Excellent clamping capability

♦ Repetition Rate (duty cycle): 0.05

♦ Fast reponse time: typically less than 1ps from 0 volts to VBR min.

♦ Typical ID less than 1µA above 10V

♦ High temperature soldering: 250°C/10 seconds at terminals

♦ Plastic package has Underwriters Laboratory Flammability Classification 94V-0