mounting, line switch, fuseh. 5x20 mm with/without voltage sel

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IEC Appliance Inlet C14 with Filter, Fuseholder 1-or 2-pole, optional Voltage Selector (Series-Parallel), Lock and Shield Mounting

文件：608.64 Kbytes Page：10 Pages

850kHz 700mA Synchronous Buck DC/DC Converter

General Description The AAT1151 SwitchReg™ is a step-down switching converter ideal for applications where high efficiency is required over the full range of output load conditions. The 2.7V to 5.5V input voltage range makes the AAT1151 ideal for single-cell lithium-ion/polymer battery applicatio

Low Drop Output Voltage Regulator

Description The S52xxM is a u-cap 150mA linear voltage regulator in the SOT-25 package. This regulator has very low dropout voltage and very low ground current. It is designed especially for hand-sets, battery-powered devices and can be controlled by a CMOS or TTL. When the S52xxM is disabled, p

Low Drop Output Voltage Regulator

Description The S52xxM is a u-cap 150mA linear voltage regulator in the SOT-25 package. This regulator has very low dropout voltage and very low ground current. It is designed especially for hand-sets, battery-powered devices and can be controlled by a CMOS or TTL. When the S52xxM is disabled, p

1.0MHz Inverting DC/DC Converter

DESCRIPTION The LX1734 is an inverting DC/DC current-mode controller. With a 750mA integrated switch, the LX1734 can generate large output currents in a small footprint. The LX1734 minimizes external component size and cost by implementing a high switching frequency of 1.0MHz, while generating -5

150MA SOT-23 ULTRA LOW NOISE CMOS RF-LDO REGULATOR

General Description The ILC7082 is a 150mA low dropout (LDO) voltage regulator designed to provide a high performance solution to low power systems. The device offers a typical combination of low dropout and low quiescent current expected of CMOS parts, while uniquely providing the low noise and

850kHz 700mA Synchronous Buck DC/DC Converter

General Description The AAT1151 SwitchReg™ is a step-down switching converter ideal for applications where high efficiency is required over the full range of output load conditions. The 2.7V to 5.5V input voltage range makes the AAT1151 ideal for single-cell lithium-ion/polymer battery applicatio

Low Drop Output Voltage Regulator

Description The S52xxM is a u-cap 150mA linear voltage regulator in the SOT-25 package. This regulator has very low dropout voltage and very low ground current. It is designed especially for hand-sets, battery-powered devices and can be controlled by a CMOS or TTL. When the S52xxM is disabled, p

150MA SOT-23 ULTRA LOW NOISE CMOS RF-LDO REGULATOR

General Description The ILC7082 is a 150mA low dropout (LDO) voltage regulator designed to provide a high performance solution to low power systems. The device offers a typical combination of low dropout and low quiescent current expected of CMOS parts, while uniquely providing the low noise and

Low Drop Output Voltage Regulator

Description The S52xxM is a u-cap 150mA linear voltage regulator in the SOT-25 package. This regulator has very low dropout voltage and very low ground current. It is designed especially for hand-sets, battery-powered devices and can be controlled by a CMOS or TTL. When the S52xxM is disabled, p

Power Conditioning Requirements

XRT7300 DS3/E3/STS-1 LIU Power Conditioning Requirements

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Chip Multilayer Ceramic Capacitors for General

This is Murata primary products renowned for both small size and large capacitance value with latest advanced technology.

Chip Multilayer Ceramic Capacitors for General

This is Murata primary products renowned for both small size and large capacitance value with latest advanced technology.

Chip Multilayer Ceramic Capacitors for General

This is Murata primary products renowned for both small size and large capacitance value with latest advanced technology.

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Ceramic Capacitors(SMD)

Specifications 180Embossed Tape 330Embossed Tape

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller

Chip Monolithic Ceramic Capacitors

Chip Monolithic Ceramic Capacitors for General Purpose GRM Series ■ Features 1. Higher resistance of solder-leaching due to the Ni-barriered termination, applicable for reflow-soldering, and flow-soldering (GRM18/21/31 type only). 2. The GRM series is lead free product. 3. Smaller