| 型号 | 功能描述 | 生产厂家 企业 | LOGO | 操作 |
|---|---|---|---|---|
GM2105 | LNA产品系列 GM2105是一款GaAs pHEMT低噪声放大器,具有带宽宽、功耗低等优点,内部集成使能功能,可用于电台通信、自组网通信等领域。 • 工作频率: 30~1000MHz \n• 工作电压: 3.3V\n• 芯片尺寸: 3mm*3mm*1mm \n; | GREATMICROWAVE 臻镭科技 | ||
512KB and 1MB BurstRAM Secondary Cache Modules for PowerPC PReP/CHRP Platforms The MPC2105A/B and the MPC2106A/B are designed to provide burstable, high performance L2 cache for the PowerPC 60x microprocessor family in conformance with the PowerPC Reference Platform (PReP) and the PowerPC Common Hardware Reference Platform (CHRP) specifications. • PowerPC–style Burst Counte | MOTOROLA 摩托罗拉 | |||
21 Voice ROM Description The MSS6605 is a single-chip CMOS VLSI ROM that can memorize voice up to 60 seconds using MOSEL qualified coding method (MPCM) at 5.8 KHz. Three addressing interfaces are provided: CPU mode, KEYBOARD mode and MATRIX mode for versatile applications. The voice content can be stored sep | MOSEL 茂矽电子 | |||
21/32/43/60 VOICE ROM Description The MSS6605 is a single-chip CMOS VLSI ROM that can memorize voice up to 60 seconds using MOSEL qualified coding method (MPCM) at 5.8 KHz. Three addressing interfaces are provided: CPU mode, KEYBOARD mode and MATRIX mode for versatile applications. The voice content can be stored sep | MOSEL 茂矽电子 | |||
21/32/43/60 VOICE ROM Description The MSS6605 is a single-chip CMOS VLSI ROM that can memorize voice up to 60 seconds using MOSEL qualified coding method (MPCM) at 5.8 KHz. Three addressing interfaces are provided: CPU mode, KEYBOARD mode and MATRIX mode for versatile applications. The voice content can be stored sep | MOSEL 茂矽电子 | |||
21/32/43/60 VOICE ROM Description The MSS6605 is a single-chip CMOS VLSI ROM that can memorize voice up to 60 seconds using MOSEL qualified coding method (MPCM) at 5.8 KHz. Three addressing interfaces are provided: CPU mode, KEYBOARD mode and MATRIX mode for versatile applications. The voice content can be stored sep | MOSEL 茂矽电子 |
GM2105产品属性
- 类型
描述
- 噪声系数(dB):
0.8
- 增益(dB):
22
- P-1(dBm):
19
- OIP3(dBm):
22
- 封装形式:
LGA
- 封装尺寸(mm*mm):
3*3*1
| IC供应商 | 芯片型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
GM |
25+ |
DIP-32 |
2800 |
原装现货!可长期供货! |
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DdatasheetPDF页码索引
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