型号 功能描述 生产厂家 企业 LOGO 操作
GC6001-00

封装/外壳:模具 包装:卷带(TR) 描述:SI NOISE NON HERMETIC CHIP 分立半导体产品 二极管 - 射频

Microchip

微芯科技

Single or multi-mode LTE Cat 1 modules with Secure Cloud

Product description LARA-R6 series modules provide global and multi-regional coverage in a very small form factor, thereby reducing logistics complexity and increasing design flexibility. Three different product variants provide flexibility for band use and access technology by region, and in

U-BLOX

LTFD 101 SERIES TELCOM DISCONNECT SWITCH/LTFD 6001 & 1200 SERIES TELCOM DISCONNECT SWITCH

Description Littelfuse compact LTFD 101 fuse holders for TLS fuses are designed for quick installation into telecom equipment panels. Their modular design fits into spaces originally designed for circuit breakers and can be front panel mounted or rear mounted using bullet connectors. The inn

Littelfuse

力特

LARA-R6 series cellular evaluation kit

文件:976.72 Kbytes Page:23 Pages

U-BLOX

Single or multi-mode LTE Cat 1 modules with Secure Cloud

文件:1.06237 Mbytes Page:41 Pages

U-BLOX

更新时间:2025-10-21 20:00:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
GC
22+
TSSOP24
100000
代理渠道/只做原装/可含税
GC
25+
TSSOP24
54658
百分百原装现货 实单必成
TI
25+
BGA-484
280
百分百原装正品 真实公司现货库存 本公司只做原装 可
22+
5000
GOLDSTAR
23+
DIP18
10000
原厂授权一级代理,专业海外优势订货,价格优势、品种
MITSUBISHI/三菱
25+
DIP
3650
全新原装正品支持含税
TI
23+
BGA484
5000
全新原装,支持实单,非诚勿扰
GOLDSTAR
25+
DIP20
4500
全新原装、诚信经营、公司现货销售
TI
23+
BGA484
12800
##公司主营品牌长期供应100%原装现货可含税提供技术
GOLDSTAR
22+
DIP-24
8500
进口原装!现货库存

GC6001-00数据表相关新闻