HIGH-DENSITY DIGITAL UPCONVERTER

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封装/外壳：388-BBGA 裸露焊盘 功能：升频器 包装：卷带（TR） 描述：IC DGTL UP-CONV HI-DENS 388-BGA RF/IF，射频/中频和 RFID RF 其它 IC 和模块

2.5 V to 5.5 V, 500 關A, Quad Voltage Output 8-/10-/12-Bit DACs in 10-Lead Packages

GENERAL DESCRIPTION The AD5304/AD5314/AD53241 are quad 8-, 10-, and 12-bit buffered voltage output DACs in 10-lead MSOP and 10-lead LFCSP packages that operate from a single 2.5 V to 5.5 V supply, consuming 500 μA at 3 V. Their on-chip output amplifiers allow rail-to-rail output swing to be achie

2.5 V to 5.5 V Octal Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP

GENERAL DESCRIPTION The AD5308/AD5318/AD5328 are octal 8-, 10-, and 12-bit buffered voltage output DACs in a 16-lead TSSOP. They operate from a single 2.5 V to 5.5 V supply, consuming 0.7 mA typical at 3 V. Their on-chip output amplifiers allow the outputs to swing rail-to-rail with a slew rate o

22 (7/30) AWG Tinned Copper

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2.5 V to 5.5 V Octal Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP

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2.5 V to 5.5 V Octal Voltage Output 8-/10-/12-Bit DACs in 16-Lead TSSOP

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