ENHANCED PERFORMANCE SURFACE MOUNT EPSM PACKAGED DEVICES

DESCRIPTION Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high per

Varactors (Surface Mount)

Our EPSM packaged devices are designed for the most demanding commercial and Military requirements where the inconsistent performance inherent in plastic surface mount packages cannot be tolerated. These package styles extend the surface mount construction format to 6 GHz for high performance wirele

ENHANCED PERFORMANCE SURFACE MOUNT EPSM?줙yperabrupt Varactor Diodes TM

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封装/外壳：模具 包装：散装 描述：SI TVAR NON HERMETIC EPSM SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

封装/外壳：2-SMD，无引线 包装：卷带（TR） 描述：SI TVAR NON HERMETIC EPSM SMT 分立半导体产品 二极管 - 可变电容（变容器，可变电抗器）

UHF-band Device Series

UHF-band Device Series

Integrated Circuit AM/FM IF

Description: The NTE1301 is a silicon monolithic integrated circuit in a 7–Lead SIP type package designed for the AM/FM IF amplifier of a radio receiver. Two differential amplifiers and an AGC circuit perform good limiting quality for FM operation and good AGC characteristics for AM operation.

Photo Interrupter

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Reflective Photosensor

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MEDIUM POWER AMPLIFIER GaAs MMIC

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