Features

• Batch process design, excellent power dissipation offers better reverse leakage current and thermal resistance.

• Low profile surface mounted application in order to optimize board space..

• Tiny plastic SMD package.

• High current capability.

• High surge current capability.

• Glass passivated chip junction.

• Lead-free parts meet RoHS requirments.

• Super fast reovery time for switching mode application.

• Suffix -H indicates Halogen free parts, ex. SFM11-MH1-H.