General Description

Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ7064N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).

Features

• 13.5 A, 30 V. RDS(ON) = 8.0 mW @ VGS = 4.5 V

RDS(ON) = 7.0 mW @ VGS = 10 V

• Occupies only 14 mm2 of PCB area. Only 42 of

the area of SO-8

• Ultra-thin package: less than 0.8 mm height when

mounted to PCB

• 3.5 x 4 mm2 Footprint

• High power and current handling capability.

Applications

• DC/DC converters

• Solenoid drive