General Description

Combining Fairchild’s 30V PowerTrench process with state of the art BGA packaging, the FDZ5047N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultra-low profile packaging, low gate charge, and low RDS(ON).

These MOSFETs feature faster switching and lower gate charge than other MOSFETs with comparable RDS(ON) specifications resulting in DC/DC power supply designs with higher overall efficiency.

Features

• 22 A, 30 V.

RDS(ON) = 2.9 mΩ @ VGS = 10 V

RDS(ON) = 4.5 mΩ @ VGS = 4.5 V

• Occupies only 27.5 mm2 of PCB area:

1/5 of the area of a TO-220 package

• Ultra-thin package: less than 0.90 mm height when mounted to PCB

• Outstanding thermal transfer characteristics

• Ultra-low gate charge x RDS(ON) product

Applications

• DC/DC converters

• Solenoid drive