General Description

Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ202P minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, high current handling capability, ultralow profile packaging, low gate charge, and low RDS(ON).

Features

• –5.5 A, –20 V. RDS(ON) = 45 mΩ @ VGS = –4.5 V

RDS(ON) = 75 mΩ @ VGS = –2.5 V

• Occupies only 5 mm2 of PCB area: only 55 of the

area of SSOT-6

• Ultra-thin package: less than 0.80 mm height when

mounted to PCB

• Outstanding thermal transfer characteristics:

4 times better than SSOT-6

• Ultra-low Qg x RDS(ON) figure-of-merit

• High power and current handling capability

Applications

• Battery management

• Load switch

• Battery protection