General Description

Designed on Fairchilds advanced 1.7V PowerTrench® process with state of the art low pitch WLCSP packaging process, the FDZ193P minimizes both PCB space and rDS(on). This advanced WLCSP MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transfer characteristics, ultra-low profile packaging, low gate charge, and low rDS(on).

Features

■ Max rDS(on) = 90mΩ at VGS = -4.5V, ID = -1A

■ Max rDS(on) = 130mΩ at VGS = -2.5V, ID = -1A

■ Max rDS(on) = 300mΩ at VGS = -1.7V, ID = -1A

■ Occupies only 1.5 mm2 of PCB area Less than 50 of the area of 2 x 2 BGA

■ Ultra-thin package: less than 0.65 mm height when mounted to PCB

■ RoHS Compliant

Application

■ Battery management

■ Load switch

■ Battery protection