E v a l u a t i o n D r i v e r B o a r d f o r 1 2 0 0 V PrimePACK™

1 Introduction The 2ED250E12-F evaluation driver board shown in Fig. 1 was developed to support customers during their first design steps with the 1200V PrimePACK™ IGBT module. The evaluation driver board is a fully functional IGBT module driver where two 1ED020I12-F driver IC process control a

PrimePACK?? Modul mit Trench/Fieldstopp IGBT4 und Emitter Controlled 4 Diode und NTC

文件：1.24346 Mbytes Page：9 Pages

PrimePACK2 Modul mit Trench

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IGBT模块

PrimePACK™2 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled Diode und bereits aufgetragenem Thermal Interface Material

Electrical Features • High short-circuit capability • High surge current capability • High current density • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features • 4 kV AC 1min insulation • Package with CTI > 400 • High creepage and clearance distances • In

PrimePACK™2 module with Trench/Fieldstop IGBT4 and Emitter Controlled 4 diode and NTC

Electrical Features • Extended Operation Temperature Tvj op • High DC Stability •High Short Circuit Capability, Self Limiting Short Circuit Current • Low VCEsat • Unbeatable Robustness • VCEsat with positive Temperature Coefficient Mechanical Features • 4 kV AC 1min Insulation • Packag

PrimePACK2 Modul mit Trench

文件：1.7171 Mbytes Page：9 Pages

IGBT 模块

封装/外壳：模块 包装：托盘 描述：PP IHM I XHP 1 7KV AG-PRIME2-411 分立半导体产品 晶体管 - IGBT - 模块

IGBT模块

封装/外壳：模块 包装：托盘 描述：IGBT MOD 1200V 600A 3350W 分立半导体产品 晶体管 - IGBT - 模块

PrimePACK2 Modul mit Trench/Feldstopp IGBT4, groberer Emitter Controlled 4 Diode and NTC

PrimePACK?? Modul mit Trench/Feldstopp IGBT4, gr철횩erer Emitter Controlled 4 Diode

文件：1.24885 Mbytes Page：9 Pages