N-Channel 2.5 V Specified PowerTrench BGA MOSFET

General Description Combining Fairchild’s advanced 2.5V specified PowerTrench process with state of the art BGA packaging, the FDZ298N minimizes both PCB space and RDS(ON). This BGA MOSFET embodies a breakthrough in packaging technology which enables the device to combine excellent thermal transf

Customer Specification

Construction 1) Component 1 1 X 1 BUSBAR a) Conductor 22 (SOLID) AWG Tinned Copper 0.025

Solid Tantalum Chip Capacitors 298D MICROTAN®, 298W Extended Range MICROTAN®, Leadframeless Molded

FEATURES • Small sizes include 0603 and 0402 footprint • Lead (Pb)-free L-shaped face-down terminations • 8 mm tape and reel packaging available per EIA-481 and reeling per IEC 60286-3 7 [178 mm] standard • Mounting: surface mount • Moisture sensitivity level 1 (for exceptions refer to “St

Blade Terminal & Special Purpose Fuses - Low Voltage

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Solid Tantalum Chip Capacitors MICROTAN™ Lead Frameless Molded

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Solid Tantalum Chip Capacitors

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