封装/外壳：模块 包装：散装 描述：IHV IHM T XHP 3 3-6 5K AG-IHVB19 分立半导体产品 晶体管 - IGBT - 模块

封装/外壳：模块 包装：托盘 描述：IGBT MODULE 3300V 1000A 分立半导体产品 晶体管 - IGBT - 模块

IHM-B module with Trench/Fieldstop IGBT3 and Emitter Controlled 3 diode

Electrical Features • High DC stability • High short-circuit capability • Low VCEsat • Unbeatable robustness • Tvj op = 150°C • VCEsat with positive temperature coefficient Mechanical Features •AlSiC base plate for increased thermal cycling capability • Package with CTI > 600 • IHM B

SCALE-2 Plug-and-Play Drivers

Features  Plug-and-play solution  Allows parallel connection of IGBT modules  For 2-level, 3-level and multilevel topologies  Built-in isolated DC/DC power supply (master)  Fiber-optic links (master)  Built-in interface to 1SP0635D2S1(C) (slave)  Duty cycle 0...100  Dynamic Advance

IHM-B module with Trench/Fieldstop IGBT3 and Emitter Controlled3 diode

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