Description

The SOT-223 package is designed for surface-mounting

using vapor phase, infrared, or wave soldering techniques.

Its unique package design allows for easy automatic pickand-

place as with other SOT or SOP packages but has the

added advantage of improved thermal performance due to

an enlarged tab for heatsinking. Power dissipation of

greater than 1.25 W is possible in a typical surface mount

application.

Features

VDS (V) = -60V

ID = -8A (VGS = -10V)

RDS(ON) < 62mΩ (VGS = -10V)