[KESTER SOLDER]

Product Description

Kester formula TSF-6522 is a no-clean tacky soldering flux formula designed to be used with a rotating disc, a doctor blade, or a drum fluxer. The TSF-6522 can also be used in dot dispensing for BGA/PGA sites or in a rework application for surface mount packages. TSF-6522 maintains its activity and dispensing characteristics for up to 8 hours and can be used in a wide range of temperature and humidity conditions. Kester maintains the highest standards by manufacturing the TSF-6522 under a vacuum environment.

• High tack values and long tack life

• Leaves bright/shiny solder joints after reflow

• ANSI/J-STD-004 flux designator ROL0

• Can reflow in air or nitrogen environments

Standard Applications:

• Works on flip chip, chip scale package and flip chip bumping sites assemblies as a soldering flux.

• Tacky solder flux formulations are designed for pin transfer, dot dispensing and/or syringe applications.

• Tacky solder flux formulations can be used as a tack and flux vehicle for soldering components to a solid solder deposit (SSD), or precision pad technology (PPT) board surfaces.

• Great for rework applications on all PCB packages.

• Can be used in BGA/PGA sphere/pin attachment vehicle or for repair and reballing/repinning.