Benefits

Patented Thermal Core Technology

Optimized thermal heat transfer to

the solder joint. Consistent soldering

for reduced rework.

MIL-SPC / IPC standard Reduces risk

of damage to sensitive components

and workpieces. No rework, lower

total cost of ownership

Active tip technology Fastest heat-up

and recovery time, sensor close to the

solder tip, excellent heat transfer. No

downtime, continuing workflow,

excellent results

Digital tool for data storage Motion

activated usage sensor for energy

control and data storage

Patented tip & grip design Only

soldering tip on the market which can

be changed without a tool. 20 faster

change than leading competitors.