M705-GRN360-MZ is eco-friendly solder paste that provides cream solder with high-temperature preheat resistance while maintaining the high printability of our former paste, GRN360-L60. This new paste mitigates problems involving defective solder fusion between solder balls and paste that have been experiencedwhen BGA/CSP devices are mounted. The use of BGA/CSP devices has recently been expanding, mainly in digital products.