Features

• One-half the volume and mass of traditional

process carriers

• One-fourth the surface area of traditional process

carriers

• Modular construction includes reinforcement

rods for added rigidity and strength

• Lift points on carrier ends for automated

handling

• V-notch locators on carrier ends and rails for

location on equipment

• Wafer capacity: 50

• Pocket spacing: 6.4 mm (0.25)

Traditional Process

Wafer Carriers

Features

• Low and high profile

• “H” bar for equipment interface

• Locating track notches at the center of the

thirteenth pocket

• Pins and holes on the top rail (unless noted)

• Wafer capacity: 25, 26 or 50

• D1 dimension: 25.4 mm (1.00)

• Pocket spacing: A192-82M: 3.2 mm (0.13)

All others: 6.4 mm (0.25)

• Pocket flat: 1.7 mm (0.07)