位置：281-1AB > 281-1AB详情
281-1AB中文资料
281-1AB数据手册规格书PDF详情
• No interface material is needed
• Copper with matte tin plating for improved solderability and assembly
• Both the component and the heat sink are installed on the PC-board utilizing
standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats
• EIA standards and ESD protection are specified
• Can be used with water soluble or no clean SMT solder creams or other pastes
FEATURES AND BENEFITS
更新时间：2025-8-1 9:09:00
| 供应商 | 型号 | 品牌 | 批号 | 封装 | 库存 | 备注 | 价格 |
|---|---|---|---|---|---|---|---|
BEL |
23+ |
NA |
19960 |
只做进口原装,终端工厂免费送样 |
|||
UNIMICRO |
23+ |
BGA256 |
50000 |
全新原装正品现货,支持订货 |
|||
UNIMICRO |
17+ |
BGA256 |
895 |
一级代理,专注军工、汽车、医疗、工业、新能源、电力 |
|||
UNIMICRO |
21+ |
BGA256 |
895 |
原装现货假一赔十 |
|||
NCR |
24+ |
DIP-24 |
10 |
||||
TI/德州仪器 |
22+ |
MSOP8 |
25000 |
只做原装,原装,假一罚十 |
|||
ST |
10+ |
SMD-8 |
7800 |
全新原装正品,现货销售 |
|||
VCC/CML |
新 |
5 |
全新原装 货期两周 |
||||
KR |
20+ |
低通滤波器 |
50 |
||||
VCC/CML |
2022+ |
1 |
全新原装 货期两周 |
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