1.1 Features

CPU and On-Chip Memory

• ESP32-D0WD-V3 embedded, Xtensa®

dual-core 32-bit LX6 microprocessor, up to 240

MHz

• 448 KB ROM for booting and core functions

• 520 KB SRAM for data and instructions

• 16 KB SRAM in RTC

Wi-Fi

• 802.11b/g/n

• Bit rate: 802.11n up to 150 Mbps

• A-MPDU and A-MSDU aggregation

• 0.4 μs guard interval support

• Center frequency range of operating channel:

2412 ~ 2484 MHz

Bluetooth

• Bluetooth V4.2 BR/EDR and Bluetooth LE

specification

• Class-1, class-2 and class-3 transmitter

• AFH

• CVSD and SBC

Peripherals

• SD card, UART, SPI, SDIO, I2C, LED PWM, Motor

PWM, I2S, IR, pulse counter, GPIO, capacitive

touch sensor, ADC, DAC, TWAI® ( compatible

with ISO 11898-1, i.e. CAN Specification 2.0)

Integrated Components on Module

• 40 MHz crystal oscillator

• 8 MB SPI flash

Antenna Options

• On-board dual PCB antennas

Operation Conditions

• Operating voltage/Power supply: 3.0 ~ 3.6 V

• Operating ambient temperature: –40 ~ 85 °C

Certification

• RF certification: See Certificates

• Green certification: REACH/RoHS

Test

• Reliability: HTOL/HTSL/uHAST/TCT/ESD