Features

CPU and On-Chip Memory

• Xtensa® dual-core 32-bit LX6 microprocessor,

up to 240 MHz

• 448 KB ROM

• 520 KB SRAM

• 16 KB SRAM in RTC

Wi-Fi

• Complies with 802.11b/g/n

• 1T1R mode with data rate up to 150 Mbps

• TX/RX A-MPDU and RX A-MSDU aggregation

• 0.4 μs guard interval support

• Center frequency range of operating channel:

2412 ~ 2484 MHz

Bluetooth

• Compliant with Bluetooth v4.2 BR/EDR and

Bluetooth LE specifications

• Class-1, class-2 and class-3 transmitter

• Adaptive Frequency Hopping (AFH)

• CVSD and SBC for audio codec

Peripherals

• Up to 34 GPIOs for ESP32-PICO-D4

– 5 strapping GPIOs

– 6 GPIOs used for in-package flash

– 6 input-only GPIOs

• Up to 31 GPIOs for ESP32-PICO-V3

– 5 strapping GPIOs

– 2 GPIOs used for in-package flash

– 6 input-only GPIOs

• Up to 31 GPIOs for ESP32-PICO-V3-02

– 5 strapping GPIOs

– 4 GPIOs used for in-package flash and

PSRAM

– 6 input-only GPIOs

• SD/SDIO/MMC Host Controller, UART, SPI,

SDIO/SPI Slave Controller, I2C, LED PWM,

Motor PWM, I2S, infrared remote controller,

pulse counter, capacitive touch sensor, ADC,

DAC, Ethernet MAC, TWAI® (compatible with

ISO 11898-1, i.e. CAN 2.0 Specifications)

In-Package Flash and PSRAM

• ESP32-PICO-D4: 4 MB flash

• ESP32-PICO-V3: 4 MB flash

• ESP32-PICO-V3-02: 8 MB flash, 2 MB PSRAM

Operating Conditions

• Operating voltage/Power supply: 3.0 ~ 3.6 V

• Operating ambient temperature: –40 ~ 85 °C