APPLICATIONS

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Primary Application: ESC T794

• Post-Cu CMP cleans

Other Applications: ESC T700

Series

• Dielectric CMP cleans

• Backside metal and particle

removal

• OSG film cleans

• Pre-deposition cleans

• Polysilicon CMP cleans

• Cu and barrier CMP pad

cleaning and conditioning

FEATURES & BENEFITS

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• Effective for organic residue

removal

• Cleans hydrophobic dielectrics

without watermarks

• Removes copper contamination

from dielectric surfaces

• Prevents brush loading

• Low copper surface roughness

• Compatible with low-k films

including porous dielectrics

• Effective at ambient

temperatures

• Demonstrated improvements

in TDDB and electromigration

• Global technical applications

support