Other Applications: ESC 700 Series

• Dielectric CMP cleans

• Pre-deposition cleans

• Polysilicon CMP cleans

• Backside metal and particle removal

• Cu and barrier CMP pad cleaning and conditioning

FEATURES & BENEFITS

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• Removes copper

contamination from

dielectric surfaces

• Excellent Cu corrosion

prevention

• Very low Cu surface

roughness

• Compatible with TEOS

and low-k films

• Very cost-effective,

used diluted ≥ 50:1

• Effective at ambient temperature

• Easily rinsed with DI water

• Demonstrated improvements

in TDDB and electromigration

• Global technical applications

support