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638-M62-232-BN5中文资料
638-M62-232-BN5数据手册规格书PDF详情
Features
High Density With Machined Contacts
0.090(2.29mm) Contact Spacing X 0.078(1.98mm) Row Spacing
Plug and Receptacle in 15, 26, 44 or 62 Contact Sizes
Pin and Socket Contact Mating Design with P.C. Tail Termination
Metal Shell Provides EMI/RFI Shielding, Plug Shell Indents provide Grounding and Additional Mating Retention
Grounding Features include Ground Plates and 4-Prong Boardlock for Exceptional Retention to P.C. Board
Mounting Options for Panel Mount or Connector Mating include Through Hole, Threaded Inserts Boardlocks and Removable Threaded Standoffs
D-Shaped Connector Mating Outline provides Polarization
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638-M62-232-BN5 芯片相关型号
- 395-042-524-502
- 395-042-524-503
- 395-042-524-504
- 395-042-524-507
- 395-042-524-512
- 638-M62-232-BN1
- 638-M62-232-BN2
- 638-M62-232-BN3
- 638-M62-232-BN4
- 638-M62-232-BN6
- 638-M62-232-BT1
- 638-M62-232-BT2
- 638-M62-232-BT3
- 638-M62-232-BT4
- 638-M62-232-BT5
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