型号 功能描述 生产厂家 企业 LOGO 操作
ESP32-PICO-MINI-02

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

ESPRESSIF

乐鑫信息科技

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

ESPRESSIF

乐鑫信息科技

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

ESPRESSIF

乐鑫信息科技

2.4 GHz WiFi Bluetooth® Bluetooth LE module Built around ESP32 series of SoCs, Xtensa® dualcore Flash up to 8 MB, PSRAM up to 2 MB 27 GPIOs, rich set of peripherals On-board PCB antenna or external antenna connector

1.1 Features CPU and OnChip Memory • ESP32-PICO-V3-02 embedded, Xtensa dual-core 32-bit LX6 microprocessor, up to 240 MHz • 448 KB ROM for booting and core functions • 520 KB SRAM for data and instructions • 16 KB SRAM in RTC • 8 MB SPI flash • 2 MB PSRAM WiFi • 802.11b/g/n • Bit rate

ESPRESSIF

乐鑫信息科技

封装/外壳:模块 包装:卷带(TR)剪切带(CT)Digi-Reel® 得捷定制卷带 描述:SMD 8 MB FLASH 2 MB PSRAM PCB AN RF/IF,射频/中频和 RFID 射频收发器模块和调制解调器

ESPRESSIF

乐鑫信息科技

通用型 Wi-Fi + Bluetooth® + Bluetooth® LE MCU 模组

ESPRESSIF

乐鑫信息科技

封装/外壳:53-SMD 模块 包装:托盘 描述:SMD MODULE, ESP32-PICO-V3-02 WIT RF/IF,射频/中频和 RFID 射频收发器模块和调制解调器

ESPRESSIF

乐鑫信息科技

更新时间:2026-1-3 15:50:00
IC供应商 芯片型号 品牌 批号 封装 库存 备注 价格
ESPRSESS
23+
QFN
20000
ESPRESSIF(乐鑫)
24+
N/A
8132
原厂可订货,技术支持,直接渠道。可签保供合同
ESPRESSIF(乐鑫)
25+
SMD-53P
500000
源自原厂成本,高价回收工厂呆滞
ESPRESSIF 乐鑫
2447
LGA-48
315000
1000个/圆盘一级代理专营品牌!原装正品,优势现货,
ESPRESSIF(乐鑫)
23+
LGA-48
6000
专注配单,只做原装进口现货
ESPRESSIF
10
ESPRESSIF
24+
con
10
现货常备产品原装可到京北通宇商城查价格
ESPRSESS
24+
QFN
9000
只做原装正品 有挂有货 假一赔十
Espressif Systems
20+
原装
29860
RF片上系统SOC-可开原型号增税票
ESPRESSIF/乐鑫
24+
MODULE
131
只做原装,欢迎询价,量大价优

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