封装/外壳：256-LBGA 包装：托盘 描述：IC FPGA 156 I/O 256FBGA 集成电路（IC） FPGA（现场可编程门阵列）

1. Cyclone III Device Family Overview

Cyclone III Device Family Overview Cyclone® III device family offers a unique combination of high functionality, low power and low cost. Based on Taiwan Semiconductor Manufacturing Company (TSMC) low-power (LP) process technology, silicon optimizations and software features to minimize power cons

EP3C25F256C8N - (受限产品), 芯片, 可编程逻辑芯片, FPGA, CYCLONE III, 25K, SMD, 3C25F256

The EP3C25F256C8N is a Cyclone® III FPGA consists of 24624 vertically arranged logic elements (LEs), 594kb of embedded memory and 66 18 x 18 embedded multipliers. The architecture includes highly efficient interconnect and low-skew clock networks, providing connectivity between logic structures for ·4 Phase-locked loops\n·83 Differential channels\n·Hot-socketing operation support\n·Routing architecture optimized for design separation flow with the Quartus® II software\n·Ability to disable external JTAG port\n·Error detection (ED) cycle indicator to core\n·Internal oscillator enables system mon;

封装/外壳：256-LBGA 包装：托盘 描述：IC FPGA 156 I/O 256FBGA 集成电路（IC） FPGA（现场可编程门阵列）