DEVICE SPECIFICATION FOR PHOTOCOUPLER

PC900V0NSZX Series ■ Description PC900V0NSZX Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. ■ Features 1. 6 pin DIP package

Mini-falt Package, General Purpose Half Pitch Photocoupler

■ Features 1. Mini-flat package 2. Half pitch type (lead pitch : 1.27mm) 3. Isolation voltage (Viso : 2 500Vrms) 4. Applicable to infrared ray reflow (230˚C, for MAX. 30s) 5. High reliability 6. Taping package PC3H7 (1ch) PC3Q67Q (4ch) 7. Recognized by UL, file No. E64380 Approved by VD

DEVICE SPECIFICATION FOR PHOTOCOUPLER

PC900V0NSZX Series ■ Description PC900V0NSZX Series contains an IRED optically coupled to an OPIC chip. It is packaged in a 6 pin DIP, available in SMT gullwing lead-form and Wide SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. ■ Features 1. 6 pin DIP package

8PIN 16 PIN ULTRA SMALL SSOP PHOTOTRANSISTOR PHOTOCOUPLER

文件：895.42 Kbytes Page：11 Pages

8PIN 16 PIN ULTRA SMALL SSOP PHOTOTRANSISTOR PHOTOCOUPLER

文件：895.42 Kbytes Page：11 Pages