包装：散装 描述：.300\ 连接器，互连器件 针座、插头和插座

SMD Schottky Barrier Diode

Io = 200 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current( IR=0.1uA typ. @VR=10V). Majority carrier conduction. Mechanical data Case: 1005(2512) standard package, molded plastic.

SMD Schottky Barrier Diode

Io = 200 mA VR = 45 Volts Features Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 1206(3216) Standard package, molded plastic . Terminals: Solder plated, solderable per MIL-STD-750, method

SMD Schottky Barrier Diode

Io = 200 mA VR = 45 Volts Features Designed for mounting on small surface Extremely thin package Low stored charge Majority carrier conduction Mechanical data Case: 0805(2012) Standard package, molded plastic . Terminals: Solder plated, solderable per MIL-STD-750, method

SMD Schottky Barrier Diode

Io = 200 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current (IR=0.1uA typ. @VR=10V). Majority carrier conduction. Mechanical data Case: 0603 (1608) Standard package , molded plastic. Terminals: Gold plat

SMD Schottky Barrier Diode

Io = 200 mA VR = 45 Volts Features Designed for mounting on small surface. Extremely thin/leadless package. Low leakage current( IR=0.1uA typ. @VR=10V). Majority carrier conduction. Mechanical data Case: 0603(1608) standard package, molded plastic.