Chip Ceramic Resonators Built-In Capacitors

FEATURES □ Ceramic Encapsulation □ High Reliability □ Designed for Reflow Soldering □ Low Profile 1.8mm APPLICATIONS □ Clock Generator □ Datacommunications □ Telecommunication □ Automotive Electronics

Chip Ceramic Resonators General Purpose

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Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe

Ceramic Res o na tors, Chip Type (3 Array Type) RoHS compliant

■ Features ● Encased in a ceramic package ● High reliability against soldering heat and mechanical stress ● Moisture-proof sealing ● 1.2 mm maximum (SS/SM/BM/JM), ● Designed for reflow soldering ● Flat-bottom plate for better mountings ● Simplifies oscillation circuits by reducing the numbe