14th/13th/12th Gen Intel® CoreTM Modular-Designed Embedded System

文件：2.68602 Mbytes Page：4 Pages

14th/13th/12th Gen Intel® CoreTM Modular-Designed Embedded System

文件：2.68602 Mbytes Page：4 Pages

14th/13th/12th Gen Intel® CoreTM Modular-Designed Embedded System

文件：2.68602 Mbytes Page：4 Pages

633M Series D-Sub Connectors | Machined Pins | High Density Three Contact Rows with 0.350 (8.89mm) Footprint Right Angle Bend | Plug

Features High Density Three Contact Rows with .350(8.89mm) Footprint Right Angle Bend with Machined Contacts .090(2.29mm) Contact Spacing 0.078(1.98mm) Row Spacing Plug and Receptacle in 15, 26, 44 or 62 Contact Sizes Pin and Socket Contact Mating Design with P.C. Tail Termination M

633 Series D-Sub Connectors | High Density Three Contact Rows with .350(8.89mm) Footprint RightAngle Bend | Plug

Features High Density Three Contact Rows with .350(8.89mm) Footprint Right Angle Bend Standard Contact Spacing and Row Spacing Optional 9th pin recessed on 15 Contact Size in accordance with VESA Display Data Channel Standard Plug and Receptacle in 15, 26, 44, 62 or 78 Contact Sizes

633W Series D-Sub Connectors | Waterproof | High Density | 0.090 (2.29mm) Contact Spacing x 0.078 (1.98mm) Row Spacing | Right Angle | Plug

Features High Density Waterproof D-Sub .090(2.29mm) Contact Spacing x .078(1.98mm) Row Spacing Plug and Receptacle in 15, 26 or 44 Contact Pin Sizes Pin Contact Mating Design with P.C. Tail Termination in Right Angle, Straight or Solder Cup Termination Plug Shell Indents Provide Gro

Low Frequencies

文件：141.01 Kbytes Page：2 Pages

60V Complementary Enhancement Mode Field Effect Transistor

文件：1.13096 Mbytes Page：10 Pages