FEATURES

● PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE

● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2, Max. < 10 of Die Area)

● Soldering Temperature: 250 °C maximum

● Mounting Position: Any

● Polarity: Color band denotes cathode

● Weight: 0.6 Ounces (1.8 Grams)