Features

· Chip produced by chemical method

· Junction passivated by high temperature resistant

insulating adhesive

· TJ=175°C capability suitable for high reliability

· Available in Bi-directional polarity only

· Low leakage current

· Low forward voltage drop

· High surge capability

· Meets ISO16750-2 surge specification

(varied by test condition)

· Meets MSL level 1，LF maximum peak of 245°C