Features

Chip produced by chemical method

Junction passivated by high temperature resistant

insulating adhesive

TJ = 175 °C capability suitable for high reliability

and automotive requirement

Available in Bi-directional polarity only

Low leakage current

Low forward voltage drop

High surge capability

Meets ISO16750-2 surge specification

varied by test condition)

Meets MSL level 1，LF maximum peak of 245 °C