100 mW, WBFBP-02C Plastic-Encapsulate Zener Diodes

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Plastic-Encapsulate Zener Diodes

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丝印代码：WF；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

丝印代码：WF；SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • 500mW Power Dissipation • General Purpose, Medium Current • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-

200 mW Zener Diodes 2.4 to 39 Volts

Features • Planar Die Construction • 200mW Power Dissipation on Ceramic PCB • General Purpose Medium Current • Ideally Suited for Automated Assembly Processes • Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1 • Lead Free Finish/RoHS Compliant(P Suffix designates

SURFACE MOUNT ZENER DIODE

Features • Planar Die Construction • Small Surface Mount Package • Ideally Suited for Automated Assembly Processes • Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen and Antimony Free. “Green” Device (Notes 3 & 4) • Qualified to AEC-Q101 Standards for High Reliabi

SURFACE MOUNT SILICON ZENER DIODES

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